02 Details

General Detail

General Description

This machine use infrared picosecond laser and professional laser head to realize cutting(no able to cut through directly), then use CO2 laser on same cutting path to assist splitting to get end product. Working platform size 600x700mm, size can customize, have dual platform option for higher efficiency working.

Features

  • Wide range cutting thickness, cutting thickness range 0.03-25mm.
  • High speed, cutting speed 0-500mm/s.
  • High accuracy, cutting accuracy ±20μm.
  • Small edge chipping, minimal edge chipping≤5μm.
  • No Burrs, no sharp edges or burrs, don’t need additional deburring operations.
  • High-yield rate: benefit from non-contact cutting, no damage to glass.
  • No taper angle, perfect cutting edge parallelism.
  • Low consumables and energy-saving
  • No pollution, no powder and no wastewater, cutting process is environmentally friendly.

 

Applied Materials

  • Standard Clear Glass
  • Ultra Clear Glass
  • Borosilicate Glass
  • Quartz Glass
  • K9 Glass
  • UTG Glass

 

Applied Products

  • Electronics Glass Cover:
  • Car Glass
  • Camera Glass Cover
  • Optical Filter Glass
  • Mirrors

 

Sample

Parameters

Machine Laser Glass Cutting And Splitting Machine
Model G6070
Working Area 600*700mm  x2,  Dual Platform
Platform Dual Marble Platform, Optional Single Platform
Cutting Laser Source Infrared Picosecond Laser, Wavelength 1064nm
-Cooling Water Cooling
-Laser Power Power 50W (Optional 30W 60W 80W)
Splitting Laser Source Co2 Laser, Wavelength 10.6µm
-Cooling Water Cooling
-Laser Power Power 150W (Optional 250W 350W)
Drive Motor XY Linear Motor + Optical Grating Scale
Linear Speed 0-1000mm/s
Cutting Speed 0-500mm/s
Acceleration 1G
Positioning Accuracy ±2um
Re-positioning Accuracy ±1.5um
Minimal Chipping 5μm
Power Consumption <8KW
Voltage AC220V 50HZ
Machine Dimension 2100x2100x1960mm
Weight 3500kg

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