02 Details
General Detail
General Description
This machine use infrared picosecond laser and professional laser head to realize cutting(no able to cut through directly), then use CO2 laser on same cutting path to assist splitting to get end product. Working platform size 600x700mm, size can customize, have dual platform option for higher efficiency working.
Features
- Wide range cutting thickness, cutting thickness range 0.03-25mm.
- High speed, cutting speed 0-500mm/s.
- High accuracy, cutting accuracy ±20μm.
- Small edge chipping, minimal edge chipping≤5μm.
- No Burrs, no sharp edges or burrs, don’t need additional deburring operations.
- High-yield rate: benefit from non-contact cutting, no damage to glass.
- No taper angle, perfect cutting edge parallelism.
- Low consumables and energy-saving
- No pollution, no powder and no wastewater, cutting process is environmentally friendly.
Applied Materials
- Standard Clear Glass
- Ultra Clear Glass
- Borosilicate Glass
- Quartz Glass
- K9 Glass
- UTG Glass
Applied Products
- Electronics Glass Cover:
- Car Glass
- Camera Glass Cover
- Optical Filter Glass
- Mirrors

Sample

Parameters
| Machine | Laser Glass Cutting And Splitting Machine |
| Model | G6070 |
| Working Area | 600*700mm x2, Dual Platform |
| Platform | Dual Marble Platform, Optional Single Platform |
| Cutting Laser Source | Infrared Picosecond Laser, Wavelength 1064nm |
| -Cooling | Water Cooling |
| -Laser Power Power | 50W (Optional 30W 60W 80W) |
| Splitting Laser Source | Co2 Laser, Wavelength 10.6µm |
| -Cooling | Water Cooling |
| -Laser Power Power | 150W (Optional 250W 350W) |
| Drive Motor | XY Linear Motor + Optical Grating Scale |
| Linear Speed | 0-1000mm/s |
| Cutting Speed | 0-500mm/s |
| Acceleration | 1G |
| Positioning Accuracy | ±2um |
| Re-positioning Accuracy | ±1.5um |
| Minimal Chipping | 5μm |
| Power Consumption | <8KW |
| Voltage | AC220V 50HZ |
| Machine Dimension | 2100x2100x1960mm |
| Weight | 3500kg |
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